16 articles for “Process Physics”

Review ArticleOpen accessIn the abstractRecent Advances in Fabrication Techniques of Perovskite Solar Cells: A ReviewAlborz Ehtesham, WeiWen Wong, H.Y. Wong, Mukter ZamanIn this study, thorough review is performed on various reported fabrication techniques of the Perovskite Solar Cell (PSC) and the Hole Transport Materials (HTM) layer, in order to provide a critical insight on the direction for further advancement in related fields as well as a better understanding on the device physics. So far, the best short-circuit current density of 22.9 … …American Journal of Applied Sciences, Vol. 13, Issue 11 · 26 Nov 2016 · 9,630 accessesView PDF Cite

Research ArticleOpen accessIn the abstractAcceleration and Particle Field Interactions of Cosmic Rays: FormalismA. Tawfik, A. Saleh, M.T. Ghoneim, A.A. HadyThe origin and acceleration theories of Ultrah High Energy Cosmic Rays (UHECRs) are still mesterious problem in modern physics and astrophysics. The acceleration of ultra high energy cosmic rays is conjectured to occur through interactions with electromagnetic fields in different astrophysical objects, like magnetic matter clumps, besides the well-known shock waves and elastic Fermi mechanisms. Based on this model, a … …Physics International, Vol. 3, Issue 2 · 18 May 2013 · 7,458 accessesView PDF Cite

Research ArticleOpen accessIn the abstractEffects of Total Ionizing Dose on Bipolar Junction TransistorChee Fuei Pien, Haider F. Abdul Amir, Saafie Salleh, Azali MuhammadProblem statement: The amount of ionizing radiation that Bipolar Junction Transistor (BJT) devices encounter during their lifecycle degrades both of their functional and electrical parameter performances. The different radiation environments either in space, high energy physics experiments, nuclear environment or fabrication process as well as for standard terrestrial operation possess an impact on the devices. Approach: In this research, analytical … …American Journal of Applied Sciences, Vol. 7, Issue 6 · 30 Jun 2010 · 8,311 accessesView PDF Cite

Research ArticleOpen accessAll words, across the recordMODELING OF PETROLEUM ENGINEERS DESIGN-TECHNOLOGICAL COMPETENCE FORMING IN PHYSICAL-MATHEMATICAL DISCIPLINES STUDYING PROCESSIlsiyar Mingatinovna Zaripova, Albina Rafisovna Shaidullina, Alla Evgenyevna Upshinskaya et al.The essence and contents of students’ project technical competence as a synthesis of design and technical competencies, including special knowledge, abilities, skills and personal qualities which are necessary for their future professional duties effective implementation, particular, for engineering projects successful implementation, requiring technical calculations performing and abilities, allowing to operate in professional activity effectively, to be guided in work situations … …American Journal of Applied Sciences, Vol. 11, Issue 7 · 19 Apr 2014 · 6,937 accessesView PDF Cite

Research ArticleOpen accessAll words, across the recordRETRACTED: Application of Sivasubramanian Kalimuthu Hypothesis to TrianglesM. SivasubramanianAt the request of the Editor-in-Chief, the Journal of Mathematics and Statistics has decided to retract the manuscript titled "Application of Sivasubramanian Kalimuthu Hypothesis to Triangles" authored by M. Sivasubramanian, published in Volume 5, Issue 2 with the page numbering 90-92. The authors have falsified findings and the article contains unsubstantiated claims and was accepted because of an administrative error. … …Journal of Mathematics and Statistics, Vol. 5, Issue 2 · 30 Jun 2009 · 7,646 accessesView PDF Cite

Research ArticleOpen accessAll words, across the recordThermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow ProcessS. Abdullah, M. F. Abdullah, A. K. Ariffin, A. JalarThe copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 7,715 accessesView PDF Cite