Author

S. Abdullah

7 articles in our journals

Articles where this person is an author, newest first. People are matched by their name as printed (no ORCID iD is recorded for them), not by name alone; search the name as text to find namesakes too.

Research ArticleOpen accessDurability Assessment of Cylinder Block for Two Stroke Free Piston Linear Engine using Random LoadingM. M. Rahman, A. K. Ariffin, S. Abdullah et al.This research presents the durability assessment of cylinder block for a two-stroke free piston engine using narrow band approach. The life prediction results are worthy for improving the component design at the very early developing stage. This approach is adequate for periodic loading, however, requires very large time records to accurately describe random loading processes. Fatigue damage in conventionally determined … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 7,455 accessesView PDF Cite

Research ArticleOpen accessAssessment of Surface Treatment on Fatigue Life of Cylinder Block for Linear Engine using Frequency Response ApproachM. M. Rahman, A. K. Ariffin, S. Abdullah et al.Objectives: This study was focused on the finite element techniques to investigate the effect of surface treatment on the fatigue life of the vibrating cylinder block for new two-stroke free piston engine using random loading conditions. Motivation: An understanding of the effects related to the random loading is necessary to improve the ability of designers to accurately predict the fatigue … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 8,142 accessesView PDF Cite

Research ArticleOpen accessThermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow ProcessS. Abdullah, M. F. Abdullah, A. K. Ariffin, A. JalarThe copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 7,719 accessesView PDF Cite

Research ArticleOpen accessA Study of Fatigue Data Editing using the Short-Time Fourier Transform (STFT)S. Abdullah, C. K.E. Nizwan, M. Z. NuawiThis study presents the development of the STFT-based fatigue data editing technique that will be used as a tool to accelerate for accelerating fatigue testing. This technique was performed by removing low amplitude cycles contained in the original signal in order to produce a shortened signal using the Short-Time Fourier Transform (STFT) parameter. The effectiveness of STFT power spectrum was … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 8,430 accessesView PDF Cite

Research ArticleOpen accessTEC and Scintillation Study of Equatorial Ionosphere: A Month Campaign over Sipitang and Parit Raja Stations, MalaysiaM. Abdullah, A. F.M. Zain, Y. H. Ho, S. AbdullahProblem Statement: Ionospheric scintillations, which cause significant effects on satellite signals for communication and navigation, often takes place in equatorial region such as Malaysia. However, this disturbance are not fully understand due to few studies performed. This research reports the study and monitoring activity on Total Electron Content (TEC) and ionospheric scintillation in Malaysia using GPS measurements. Approach: One dual-frequency … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 9,506 accessesView PDF Cite

Research ArticleOpen accessEffect of Manufacturing Stresses to Die Attach Film Performance In Quad Flatpack No-Lead Stacked Die PackagesM. F. Rosle, I. Abdullah, S. Abdullah et al.Problem statement: Repeated heat cure during assembly processes affected the Die Attach Film (DAF) material properties and the effectiveness touched area that leads to weak die bonding and delamination. Suitable die attached condition and DAF material selection had been evaluated to achieve required reliability performance in the manufacturing of the 3D Quad Flat No-Lead (QFN) stacked die package. Approach: During … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 8,054 accessesView PDF Cite

Research ArticleOpen accessDesigning for Comfort and Reliability in an Intelligent Car SeatD.A. Wahab, N.F. Adull Manan, M.A. Hannan et al.Today, intelligent safety systems are installed in modern cars in view of minimising road hazards. An intelligent air bag system for example, comprised several subsystems that are integrated to include the weight sensor system, image sensor system, crash sensor system and tyre pressure monitoring system. These systems when poorly positioned into the car seat, will certainly affect comfort and reliability … …American Journal of Applied Sciences, Vol. 5, Issue 12 · 31 Dec 2008 · 7,601 accessesView PDF Cite