3 results for “reliability thermo-mechanical”

Set a search alert

Research ArticleOpen accessIn the keywordsComparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal CyclingZ. Kornain, A. Jalar, N. Amin et al.Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via … …American Journal of Engineering and Applied Sciences, Vol. 3, Issue 1 · 31 Mar 2010 · 9,195 accessesView PDF Cite

EditorialOpen accessIn the abstractVolume 2: and SGAMR Goes!Chiara Bedon, Mario D’Aniello, Flavio StochinoThe year 2018 starts with a great confirmation for SGAMR! The journal has been selected to host the extended version of some selected papers presented during the 6th International Workshop on Design in Civil and Environmental Engineering (DCEE2017), held at the University of Cagliari (Italy) during November 2017. A summary of selected papers from highly ranked, international scientists can be … …International Journal of Structural Glass and Advanced Materials Research, Vol. 4, Issue 1 · 28 Aug 2020 · 5,737 accessesView PDF Cite

Research ArticleOpen accessAll words, across the recordThermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow ProcessS. Abdullah, M. F. Abdullah, A. K. Ariffin, A. JalarThe copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 7,715 accessesView PDF Cite