Author

N. Amin

University Kebangsaan Malaysia, Malaysia

2 articles in our journals

Articles where this person is an author, newest first. People are matched by their name as printed (no ORCID iD is recorded for them), not by name alone; search the name as text to find namesakes too.

Research ArticleOpen accessComparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal CyclingZ. Kornain, A. Jalar, N. Amin et al.Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via … …American Journal of Engineering and Applied Sciences, Vol. 3, Issue 1 · 31 Mar 2010 · 9,195 accessesView PDF Cite

Research ArticleOpen accessModeling the Effect of P-N Junction Depth on the Output of Planer and Rectangular Textured Solar CellsF. Jahanshah, K. Sopian, S. H. Zaidi et al.Problem statement: High cost of the solar cells is one of the important limitations in extensively using of the photovoltaic panels. Thin monocrystalline silicon solar cell could be reduce the cost but lost the absorption efficiency. Surface texturing help to enhance absorption. Using of advance texturing by diffraction grating was suggested for high absorption. It is necessary to investigate the … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 8,219 accessesView PDF Cite