4 articles for “abrasive wear”

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Research ArticleOpen accessPhrase in the titleANN Based Prediction of Effect of Reinforcements on Abrasive Wear Loss and Hardness in a Hybrid MMCP. Sathyabalan, V. Selladurai, P. SakthivelProblem statement: The reinforcements added to an alloy lead to variation in properties. The content and size of the reinforcement influences the properties of composites. Very little research has been carried out in hybrid composites. Work on hybrid LM6 aluminium alloy metal matrix composites (MMC) with flyash and SiC has been initiated here. The effect of the four parameters, size … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 7,551 accessesView PDF Cite

Research ArticleOpen accessIn the keywordsDevelopment of a Wear Map for the Sliding and Rotational Wear behavior of ShaftsAl-mahasne Mayas MohammadThis study was an attempt to study the wear calculation method for rotating shaft in the friction couple type shaft-cuff in conditions of oiling in high dusty environment. The size and quantity of abrasive particles that go into the clearance between friction surfaces, definition of the pressure including the load in conjugate that is given by the cuff spring as … …American Journal of Applied Sciences, Vol. 3, Issue 12 · 31 Dec 2006 · 6,913 accessesView PDF Cite

Research ArticleOpen accessIn the abstractMachining Performance Study on Metal Matrix Composites-A Response Surface Methodology ApproachA. Srinivasan, R. M. Arunachalam, S. Ramesh, J. S. SenthilkumaarProblem statement: Metal Matrix Composites (MMC) have become a leading material among composite materials and in particular, particle reinforced aluminum MMCs have received considerable attention due to their excellent engineering properties. These materials are known as the difficult-to-machine materials because of the hardness and abrasive nature of reinforcement element-like Alumina (Al2O3). Approach: In this study, an attempt has been made … …American Journal of Applied Sciences, Vol. 9, Issue 4 · 15 Feb 2012 · 8,017 accessesView PDF Cite

Research ArticleOpen accessIn the abstractStudy on Contact Forms in Wafer Chemical Mechanical Polishing in NanomachiningSu Jianxiu, Du Jiaxi, Chen Xiqu, Kang RenkeChemical Mechanical Polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. Problem statement: Studying the Contact Forms in Wafer Chemical Mechanical Polishing. Approach: A series test on the abrasion behavior and the lubricating behavior was conducted and then the test results were investigated by the abrasion and lubrication theory. Results: By the test results … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 21 Jun 2011 · 7,282 accessesView PDF Cite