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Author

Kang Renke

Dalian University of Technology, China
1 article in our journals

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Research ArticleOpen accessStudy on Contact Forms in Wafer Chemical Mechanical Polishing in NanomachiningSu Jianxiu, Du Jiaxi, Chen Xiqu, Kang RenkeChemical Mechanical Polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. Problem statement: Studying the Contact Forms in Wafer Chemical Mechanical Polishing. Approach: A series test on the abrasion behavior and the lubricating behavior was conducted and then the test results were investigated by the abrasion and lubrication theory. Results: By the test results … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 21 Jun 2011 · 7,286 accessesView PDFCite