4 articles for “material removal mechanism”

Research ArticleOpen accessIn the keywordsAbrasive Jet Polishing and its Applications in Surface FinishingZhaoze Li, Jianmin Wang, Xiaoqiang Peng et al.Problem statement: Single Point Diamond Turning (SPDT) is highly deterministic and versatile in producing various forms of precise optics. A typical example is the production of large off-axis aspheric mirrors and various infrared mirrors and mandrels. However, the fine periodical turning marks left in the surface critically limit its performance and they are difficult to be avoided for traditional polishing … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 26 Jul 2011 · 13,587 accessesView PDF Cite

Review ArticleOpen accessIn the abstractDisinfection of Water using Supported Titanium Dioxide PhotocatalystsShamkumar Pandurang Deshmukh, Dattatray Krishna Dalavi, Yuvaraj Mohan HungeTiO2 based photocatalyst has potential material for disinfection of harmful pathogens as well as removal of organic compounds. The formation of reactive oxygen species is a key part for overall process but aggregation and band gap constraint explore a new dimension to use of support for propounding its physicochemical properties. Therefore, the modification of TiO2 using various support alters photocatalytic … …American Journal of Engineering and Applied Sciences, Vol. 13, Issue 4 · 28 Dec 2020 · 7,261 accessesView PDF Cite

Research ArticleOpen accessIn the abstractMolecular Dynamics Investigation of Cutting Force in Nanometric Cutting of Monocrystalline SiliconY.H. Chen, F.Z. Fang, X.D. Zhang, X.T. HuProblem statement: Ultra-precision machining of monocrystalline silicon has become tremendously important in microelectronic, micromechanical and optical element manufacturing and the mechanism of nanometric cutting monocrystalline silicon has been a focused research topic. Molecular Dynamics (MD) simulation is developed as an effective way for studying the material removal process at nanometric scale. Approach: Molecular Dynamics (MD) simulation of nanometric cutting is … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 21 Jun 2011 · 8,403 accessesView PDF Cite

Research ArticleOpen accessIn the abstractStudy on Contact Forms in Wafer Chemical Mechanical Polishing in NanomachiningSu Jianxiu, Du Jiaxi, Chen Xiqu, Kang RenkeChemical Mechanical Polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. Problem statement: Studying the Contact Forms in Wafer Chemical Mechanical Polishing. Approach: A series test on the abrasion behavior and the lubricating behavior was conducted and then the test results were investigated by the abrasion and lubrication theory. Results: By the test results … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 21 Jun 2011 · 7,282 accessesView PDF Cite