Sign inSubmit
Tips: “quotes” for a phrase · author:Lee · a DOI goes straight to its article

8 articles for “glass transition temperature”
Set a search alert
Research ArticleOpen accessIn the keywordsOptical and Physical Properties of Bismuth Borate Glasses Doped With Dy3+Pichet Limsuwan, Jakrapong Kaewkhao, Parnuwat Chimalawong, Smit InsiripongThis study reports on physical and optical properties of Dy3+ doped bismuth borate glass. The glasses containing Dy3+ in (70-x)B2O3:30Bi2O3:xDy2O3 (where x = 0.0-2.5 mol%) have been prepared by melt-quenching method. In order to understand the role of Dy2O3 in these glasses, the density, molar volume and optical spectra were investigated. The results show that molar volume of the glasses … …American Journal of Applied Sciences, Vol. 8, Issue 6 · 13 Jun 2011 · 7,355 accessesView PDFCite
Research ArticleOpen accessIn the abstractCold Crystallization Behavior of a Zr44-Ti11-Cu10-Ni10-Be25 Metal Glassy AlloyRaffaella Aversa, Daniela Parcesepe, Francesco Tamburrino et al.Liquid crystals, a substance that flows like a liquid but has some degree of ordering in the arrangement of its molecules. "Depending on temperature or the presence of an electric potential difference, molecules in a liquid crystal can either be randomly, partially or completely aligned."Isothermal cycles of the metalized metallic alloy Zr44-Ti11-Cu10-Ni10-Be25 (cold crystallization obtained by heating the glassy glass … …American Journal of Engineering and Applied Sciences, Vol. 11, Issue 2 · 19 Jun 2018 · 8,184 accessesView PDFCite
Research ArticleOpen accessIn the abstractFactors Affecting Chemo-physical and Rheological Behaviour of Zr44-Ti11-Cu10-Ni10-Be25 Metal Glassy Alloy Supercooled LiquidsApicella Antonio, Aversa RaffaellaSegregation by selective cold crystallizations and glass transition changes in Zr44-Ti11-Cu10-Ni10-Be25 metal supercooled metastable liquid annealed at different temperatures have been theoretically correlated to melt viscosity modifications. Crystallization behavior has been found to be principally related to the high mobility and smaller Be, Cu and Ni atoms. Multiple exothermal peaks in isothermal DSC annealing’s have been observed in these bulk … …American Journal of Engineering and Applied Sciences, Vol. 9, Issue 1 · 25 Feb 2016 · 8,142 accessesView PDFCite
Research ArticleOpen accessIn the abstractComposition Dependent Structural and Thermal Properties of SM2O3 Doped Zinc Fluoroborate GlassesSudha D. Kamath, Akshatha Wagh, M.P. AjithkumarGlasses based on Sm3+ doped zinc fluoroborate have been synthesized and characterized. Formation of glass has been investigated in the 30 ZnF2-20 TeO2-(50-x) B2O3-x Sm2O3 matrix. Fast quenching is required to prevent melt crystallization and adequate heat treatment to diminish thermal stress, which results in an efficient amorphous material. The Differential Scanning Calorimeter (DSC), Scanning Electron Microscopy (SEM), Energy Dispersive … …Energy Research Journal, Vol. 4, Issue 2 · 15 Jul 2014 · 7,244 accessesView PDFCite
Research ArticleOpen accessIn the abstractImprovement of the Thermal, Photo and Mechanical Properties of Poly (Vinyl Chloride) in Presence of Poly (Glycidyl Methacrylate)Abir S. Abdel-NabyProblem statement: Poly (vinyl chloride) suffers from poor heat stability. The thermal degradation of the polymer leads to the evolution of hydrogen chloride gas, extensive discoloration of the polymer and lowering of physical and mechanical properties. Approach: Binary blends of Poly (Vinyl Chloride) (PVC) and Poly (Glycidyl Methacrylate) (PGMA) have been prepared by solution blending aimed at the improvement of … …American Journal of Applied Sciences, Vol. 8, Issue 7 · 24 Jun 2011 · 7,374 accessesView PDFCite
Research ArticleOpen accessIn the abstractComparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal CyclingZ. Kornain, A. Jalar, N. Amin et al.Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via … …American Journal of Engineering and Applied Sciences, Vol. 3, Issue 1 · 31 Mar 2010 · 9,195 accessesView PDFCite
Research ArticleOpen accessIn the abstractHeating Effects on Structural and Electrical Properties of PolyetherimideNissaf Mzabi, Hichem Smaoui, Hajer Guermazi et al.Problem statement: Polyetherimide (PEI) has several uses such as electrical insulation. It can undergo different constraints like heat or high voltage which influence its performances as insulator. In this study, the effects of heating on structural and electrical properties of polyetherimide (Ultem 1000) are studied. Approach: PEI samples were heated at different temperatures below the glass transition temperature (175, 190 … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 8,550 accessesView PDFCite
Research ArticleOpen accessIn the abstractEffect of Manufacturing Stresses to Die Attach Film Performance In Quad Flatpack No-Lead Stacked Die PackagesM. F. Rosle, I. Abdullah, S. Abdullah et al.Problem statement: Repeated heat cure during assembly processes affected the Die Attach Film (DAF) material properties and the effectiveness touched area that leads to weak die bonding and delamination. Suitable die attached condition and DAF material selection had been evaluated to achieve required reliability performance in the manufacturing of the 3D Quad Flat No-Lead (QFN) stacked die package. Approach: During … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 8,048 accessesView PDFCite