Research ArticleOpen accessIn the keywordsStudy on Contact Forms in Wafer Chemical Mechanical Polishing in NanomachiningSu Jianxiu, Du Jiaxi, Chen Xiqu, Kang RenkeChemical Mechanical Polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. Problem statement: Studying the Contact Forms in Wafer Chemical Mechanical Polishing. Approach: A series test on the abrasion behavior and the lubricating behavior was conducted and then the test results were investigated by the abrasion and lubrication theory. Results: By the test results … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 21 Jun 2011 · 7,282 accessesView PDFCite
Research ArticleOpen accessIn the keywordsPreparation and Polishing Properties of Spherical Porous Silica AbrasiveHong Lei, Hu Li, Ping Liu, Ruling ChenProblem statement: Abrasive is one of key influencing factors on the polished surface quality in Chemical Mechanical Polishing (CMP). Solid abrasives in CMP slurries are easy to cause polishing scratches. It is well known that reducing the hardness of abrasives would improve the polished surface quality. Therefore, the change in structure or shape of the abrasives means a change in … …Current Research in Nanotechnology, Vol. 1, Issue 1 · 15 Jun 2011 · 9,285 accessesView PDFCite