2 results for “abrasion behavior”

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Research ArticleOpen accessIn the keywordsStudy on Contact Forms in Wafer Chemical Mechanical Polishing in NanomachiningSu Jianxiu, Du Jiaxi, Chen Xiqu, Kang RenkeChemical Mechanical Polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. Problem statement: Studying the Contact Forms in Wafer Chemical Mechanical Polishing. Approach: A series test on the abrasion behavior and the lubricating behavior was conducted and then the test results were investigated by the abrasion and lubrication theory. Results: By the test results … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 21 Jun 2011 · 7,282 accessesView PDF Cite

Research ArticleOpen accessIn the abstractTribological Performance of Materials Under Bio-Three Body AbrasionJasem G. Alotaibi, Ako K. Omer, Nbhan D Salih, Belal F. YousifThis study aims to investigate the effects of seed grinding process on the tribological characteristics of components in agricultural machines. The objective is to conduct the the effect of third body presence such as seeds on the tribological behavior of agriculture machines and evaluate the fracture mechanism of the seeds under three body abrasion loading conditions. The work consists of … …American Journal of Applied Sciences, Vol. 17, Issue 1 · 14 Jul 2020 · 7,178 accessesView PDF Cite