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4 results for “Mechanical Cycling”
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Research ArticleOpen accessIn the keywordsCyclic Instability of Shape-Memory Alloys in Seismic Isolation SystemsFilipe Amarante dos Santos, Corneliu Cismasiu, Francisco Braz FernandesShape-memory alloys are being progressively introduced as kernel components in seismic retrofitting devices for civil engineering structures. In order to control the instability associated with the first mechanical cycles, a training procedure is usually implemented, which stabilizes the superelastic behavior of the alloy. This paper addresses the characterization of the cyclic behavior of an austenitic NiTi alloy with emphasis on … …International Journal of Structural Glass and Advanced Materials Research, Vol. 2, Issue 1 · 7 Jan 2018 · 6,854 accessesView PDFCite
Research ArticleOpen accessIn the abstractMechanical and Microstructural Characterization of Plasma Welded Joints of 18 Ni-300 Maraging Steels Subjected to RepairsPaulo Roberto Sakai, Deivid Ferreira da Silva, Milton Sérgio Fernandes de Lima et al.Among the ultra-high strength structural steels, 18Ni-300 Maraging steel is one of the most important for the naval and aerospace industries. For example, in the manufacture of motor envelopes Plasma Arc Welding-PAW processes are used with the keyhole technique. The joints are regions of high responsibility and undergo a non-destructive inspection according to the standardized technical criteria. If there is … …Journal of Aircraft and Spacecraft Technology, Vol. 5, Issue 1 · 19 Apr 2021 · 7,599 accessesView PDFCite
Research ArticleOpen accessIn the abstractComparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal CyclingZ. Kornain, A. Jalar, N. Amin et al.Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via … …American Journal of Engineering and Applied Sciences, Vol. 3, Issue 1 · 31 Mar 2010 · 9,195 accessesView PDFCite