4 articles for “A. Jalar”

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Research ArticleOpen accessIn the author namesComparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal CyclingZ. Kornain, A. Jalar, N. Amin et al.Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via … …American Journal of Engineering and Applied Sciences, Vol. 3, Issue 1 · 31 Mar 2010 · 9,195 accessesView PDF Cite

Research ArticleOpen accessIn the author namesThermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow ProcessS. Abdullah, M. F. Abdullah, A. K. Ariffin, A. JalarThe copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 7,715 accessesView PDF Cite

Research ArticleOpen accessIn the author namesEffect of Manufacturing Stresses to Die Attach Film Performance In Quad Flatpack No-Lead Stacked Die PackagesM. F. Rosle, I. Abdullah, S. Abdullah et al.Problem statement: Repeated heat cure during assembly processes affected the Die Attach Film (DAF) material properties and the effectiveness touched area that leads to weak die bonding and delamination. Suitable die attached condition and DAF material selection had been evaluated to achieve required reliability performance in the manufacturing of the 3D Quad Flat No-Lead (QFN) stacked die package. Approach: During … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 8,048 accessesView PDF Cite

Research ArticleOpen accessIn the author namesThe Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) DepositionM.K. Md Arshad, A. Jalar, I. Ahmad, G. OmarThis study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment to achieve successful nickel deposition and provide reliable interconnection of under bump metallurgy in advanced packaging. During this treatment process, the aluminum pad was cleaned, activated and … …American Journal of Applied Sciences, Vol. 4, Issue 3 · 31 Mar 2007 · 7,722 accessesView PDF Cite