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94 results for “Thermal Performance”
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Research ArticleOpen accessIn the abstractLead Free Solder Joint Thermal Condition in Semiconductor PackagingM. Najib Harif, Allina Nadzri, Kamaruzaman JusoffProblem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique … …American Journal of Applied Sciences, Vol. 7, Issue 7 · 31 Jul 2010 · 7,160 accessesView PDFCite
Research ArticleOpen accessIn the abstractPerceived Kitchen Environment among Malaysian ElderlyZahari Taha, Ruhaizin SulaimanProblem statement: Kitchen is the most important room in a house. Its environment should be highly conducive especially for the elderly when performing daily kitchen activities. There has been little research focused on the environment quality of the elderly kitchen in Malaysia. Only a few researches have been done on general home environment although our preliminary findings shown that the … …American Journal of Engineering and Applied Sciences, Vol. 3, Issue 2 · 30 Jun 2010 · 7,682 accessesView PDFCite
Research ArticleOpen accessIn the abstractAnalyzing Performance and Power of Multicore Architecture Using Multithreaded Iterative SolverIngyu LeeProblem statement: Scientific modeling and simulations have been popularly used with experiments and theoretical analysis in science and engineering communities. Approach: Consequently, computational demands are growing exponentially to afford large scale modeling and simulations. Results: As a result, multicore computing architectures had been proposed and several products are already available. However, we do not have a proper study on the … …Journal of Computer Science, Vol. 6, Issue 4 · 30 Apr 2010 · 7,212 accessesView PDFCite
Research ArticleOpen accessIn the abstractComparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal CyclingZ. Kornain, A. Jalar, N. Amin et al.Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via … …American Journal of Engineering and Applied Sciences, Vol. 3, Issue 1 · 31 Mar 2010 · 9,195 accessesView PDFCite
Research ArticleOpen accessIn the abstractEvaluation of Single-Pass Photovoltaic-Thermal Air Collector with Rectangle Tunnel AbsorberGoh Li Jin, Adnan Ibrahim, Yee Kim Chean et al.Problem statement: Photovoltaic solar cell generate electric by receiving sun light or solar irradiance. But solar cell received heat from solar irradiance as well and this will reduced the efficiency of the solar cell. The heat trap at the solar photovoltaic panel become waste energy. Approach: The solution for this was by adding a cooling system to the photovoltaic panel. … …American Journal of Applied Sciences, Vol. 7, Issue 2 · 28 Feb 2010 · 8,327 accessesView PDFCite
Research ArticleOpen accessIn the abstractA Novel Approach for Cooling Electronics Using a Combined Heat Pipe and Thermoelectric ModuleBanjerd Saengchandr, Nitin V. AfzulpurkarThe development of effective cooling systems for microprocessors, specifically for CPU and other computer chips, is greatly important due to growth of high speed performance chips, which operate at elevated heat rates. The same issues apply for adjacent units including RAM and HDD also contributing to overall generation of heat inside computer. Problem statement: Conventional cooling system for desktop PC … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 4 · 31 Dec 2009 · 7,366 accessesView PDFCite
Research ArticleOpen accessIn the abstractMathematical Model of Double Pass Photovoltaic Thermal Air Collector with FinsEbrahim M. Ali Alfegi, Kamaruzzaman Sopian, Mohd Yusof Hj Othman, Baharudin Bin YatimProblem statement: The efficiency of photovoltaic cells is generally temperature dependent (efficiency decrease when the temperature of the photovoltaic cells increase). This problem can be solved by cooling the solar cells during operation and operated at low temperature. Approach: This study presented a numerical model of double pass Photovoltaic Thermal (PV/T) solar air collector with fins attached to the back … …American Journal of Environmental Sciences, Vol. 5, Issue 5 · 31 Oct 2009 · 8,006 accessesView PDFCite
Research ArticleOpen accessIn the abstractNumerical Study on the Performance Characteristics of Hydrogen Fueled Port Injection Internal Combustion EngineRosli A. Bakar, Mohammed K. Mohammed, M. M. RahmanThis study was focused on the engine performance of single cylinder hydrogen fueled port injection internal combustion engine. GT-Power was utilized to develop the model for port injection engine. One dimensional gas dynamics was represented the flow and heat transfer in the components of the engine model. The governing equations were introduced first, followed by the performance parameters and model … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 2 · 30 Jun 2009 · 8,140 accessesView PDFCite
Research ArticleOpen accessIn the abstractThermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow ProcessS. Abdullah, M. F. Abdullah, A. K. Ariffin, A. JalarThe copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 7,715 accessesView PDFCite
Research ArticleOpen accessIn the abstractEffect of Manufacturing Stresses to Die Attach Film Performance In Quad Flatpack No-Lead Stacked Die PackagesM. F. Rosle, I. Abdullah, S. Abdullah et al.Problem statement: Repeated heat cure during assembly processes affected the Die Attach Film (DAF) material properties and the effectiveness touched area that leads to weak die bonding and delamination. Suitable die attached condition and DAF material selection had been evaluated to achieve required reliability performance in the manufacturing of the 3D Quad Flat No-Lead (QFN) stacked die package. Approach: During … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 8,048 accessesView PDFCite