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1 result for “electroless nickel immersion gold (ENIG)”
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Research ArticleOpen accessPhrase in the titleThe Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) DepositionM.K. Md Arshad, A. Jalar, I. Ahmad, G. OmarThis study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment to achieve successful nickel deposition and provide reliable interconnection of under bump metallurgy in advanced packaging. During this treatment process, the aluminum pad was cleaned, activated and … …American Journal of Applied Sciences, Vol. 4, Issue 3 · 31 Mar 2007 · 7,728 accessesView PDFCite