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Research ArticleOpen accessIn the keywordsEffect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material AssemblyD. Sujan, Z. Oo, M. V.V. Murthy, K. N. SeetharamuProblem statement: The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the risk of structural and functional failure. Approach: In this analysis, a model was proposed for the … …American Journal of Applied Sciences, Vol. 7, Issue 6 · 30 Jun 2010 · 7,068 accessesView PDFCite