4 results for “Packing Density”

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Research ArticleOpen accessPhrase in the titleEvaluation of Binary and Ternary Models in Powder Packing Density for Additive Manufacturing ApplicationsTaher M. Abu-Lebdeh, Oluwatobiloba Adetokunbo KalejaiyePowder packing is a very important aspect of additive manufacturing (3-D printing), as it directly impacts the final physical and mechanical properties of the printed objects. Improving the packing density of powder directly impacts the microstructure of the finished 3D-printed product, which also contributes to the surface finish. In order to achieve the densest packing for a powder, different sizes … …American Journal of Engineering and Applied Sciences, Vol. 14, Issue 2 · 15 Jun 2021 · 7,275 accessesView PDF Cite

Research ArticleOpen accessIn the abstractTYPICAL MEXICAN AGROINDUSTRIAL RESIDUES AS SUPPORTS FOR SOLID-STATE FERMENTATIONDulce A. Flores-Maltos, Solange I. Mussatto, Juan C. Contreras Esquivel et al.Biological wastes contain several reusable substances of high value such as soluble sugars and fiber. Direct disposal of such wastes to soil or landfill causes serious environmental problems. Thus, the development of potential value-added processes for these wastes is highly attractive. These biological wastes can be used as support-substrates in Solid-State Fermentation (SSF) to produce industrially relevant metabolites with great … …American Journal of Agricultural and Biological Sciences, Vol. 9, Issue 3 · 18 Mar 2014 · 7,473 accessesView PDF Cite

Research ArticleOpen accessIn the abstractHARMONICS REDUCTION IN FRONT END RECTIFER OF UNINTERRUPTIBLE POWER SUPPLIES WITH ACTIVE CURRENT INJECTIONT. Chandrasekar, B. Justus Rabi, A. KannanHarmonics are the by-products of modern electronics devices so it is necessary to mitigate the harmonics and offer techniques to mitigation of harmonics. It is greatly hampered by a three phase rectifier used as a front-end ac-to-dc converter in many systems. High power factor is achieved by injecting high-frequency currents into the three-phase rectifier. This study presents the high power … …American Journal of Applied Sciences, Vol. 11, Issue 4 · 1 Feb 2014 · 6,803 accessesView PDF Cite

Research ArticleOpen accessIn the abstractAdaptive Complementary Metal-Oxide-Semiconductor Device by Externally Controlled Gate Oxide ThicknessB. Gopi, R. S.D. WahidabanuProblem statement: Since the advent of IC and VLSI technology, the demand for high-speed devices and equipment is growing very rapidly. Every individual researcher is marching towards the dream of achieving it. The role of a design engineer is becoming more challenging. As per Moore’s law, the packing density doubles every eighteen months. This is possible only by scaling down … …Journal of Computer Science, Vol. 8, Issue 4 · 1 Feb 2012 · 7,103 accessesView PDF Cite