Research ArticleOpen accessIn the keywordsPreparation and Polishing Properties of Spherical Porous Silica AbrasiveHong Lei, Hu Li, Ping Liu, Ruling ChenProblem statement: Abrasive is one of key influencing factors on the polished surface quality in Chemical Mechanical Polishing (CMP). Solid abrasives in CMP slurries are easy to cause polishing scratches. It is well known that reducing the hardness of abrasives would improve the polished surface quality. Therefore, the change in structure or shape of the abrasives means a change in … …Current Research in Nanotechnology, Vol. 1, Issue 1 · 15 Jun 2011 · 9,285 accessesView PDFCite
Research ArticleOpen accessIn the keywordsFuzzy Parametric Deduction for Material Removal Rate OptimizationTian-Syung LanProblem statement: A general optimization scheme without equipment operations for CNC (computer numerical control) finish turning is deemed to be necessarily developed. Approach: In this study, four parameters (cutting depth, feed rate, speed, tool nose runoff) with three levels (low, medium, high) were considered to optimize the Material Removal Rate (MRR) based on L9(34) orthogonal array. Twenty-seven fuzzy control rules … …Journal of Mathematics and Statistics, Vol. 7, Issue 1 · 31 Jan 2011 · 7,239 accessesView PDFCite
Research ArticleOpen accessIn the abstractStudy on Contact Forms in Wafer Chemical Mechanical Polishing in NanomachiningSu Jianxiu, Du Jiaxi, Chen Xiqu, Kang RenkeChemical Mechanical Polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. Problem statement: Studying the Contact Forms in Wafer Chemical Mechanical Polishing. Approach: A series test on the abrasion behavior and the lubricating behavior was conducted and then the test results were investigated by the abrasion and lubrication theory. Results: By the test results … …Current Research in Nanotechnology, Vol. 1, Issue 2 · 21 Jun 2011 · 7,282 accessesView PDFCite
Research ArticleOpen accessIn the abstractPerformance of Difference Electrode Materials in Electrical Discharge Machining of Tungsten CarbideP. Janmanee, A. MuttamaraProblem statement: Electrical Discharge Machining (EDM) is now a well-established machining option in many industries. Tungsten carbide (WC-Co) is an important tool and die material mainly because of its high hardness, strength, wear resistance and high melting point. Normally, EDM is capable of machining geometrically complex or hard material component, that are precise and difficult to machine. The objective of … …Energy Research Journal, Vol. 1, Issue 2 · 31 Oct 2010 · 8,871 accessesView PDFCite
Research ArticleOpen accessIn the abstractFuzzy Deduction Material Removal Rate Optimization for Computer Numerical Control TurningTian-Syung LanProblem statement: Material Removal Rate (MRR) is often a major consideration in the modern Computer Numerical Control (CNC) turning industry. Most existing optimization researches for CNC finish turning were either accomplished within certain manufacturing circumstances, or achieved through numerous equipment operations. Therefore, a general deduction optimization scheme is deemed to be necessary proposed for the industry. Approach: In this study, … …American Journal of Applied Sciences, Vol. 7, Issue 7 · 31 Jul 2010 · 6,967 accessesView PDFCite