4 results for “Electronics cooling”

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Research ArticleOpen accessEvery word in the titleA Novel Approach for Cooling Electronics Using a Combined Heat Pipe and Thermoelectric ModuleBanjerd Saengchandr, Nitin V. AfzulpurkarThe development of effective cooling systems for microprocessors, specifically for CPU and other computer chips, is greatly important due to growth of high speed performance chips, which operate at elevated heat rates. The same issues apply for adjacent units including RAM and HDD also contributing to overall generation of heat inside computer. Problem statement: Conventional cooling system for desktop PC … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 4 · 31 Dec 2009 · 7,366 accessesView PDF Cite

Research ArticleOpen accessIn the keywordsHeat Transfer Augmentation for Electronic CoolingSuabsakul GururatanaProblem statement: The performance of electronic devices has been improving along with the rapid technology development. Cooling of electronic systems is consequently essential in controlling the component temperature and avoiding any hot spot. The study aims to review the present electronic cooling methods which are widely used in electronic devices. Approach: There are several methods to cool down the electronics … …American Journal of Applied Sciences, Vol. 9, Issue 3 · 2 Feb 2012 · 7,712 accessesView PDF Cite

Research ArticleOpen accessIn the abstractHeat Transfer Enhancement of Small Scale Heat Sinks Using Vibrating Pin FinSuabsakul Gururatana, Xianchang LiHeat sinks are widely adopted in electronics cooling together with different technologies to enhance the cooling process. For the small electronics application, the small scale pin fins heat sinks are extensively used to dissipate heat in electronics devices. Due to the limit of space in the small devices, it is impossible to increase heat transfer area. In order to improve … …American Journal of Applied Sciences, Vol. 10, Issue 8 · 24 Jul 2013 · 6,867 accessesView PDF Cite

Research ArticleOpen accessIn the abstractNumerical Simulation of Micro-Channel Heat Sink with Dimpled SurfacesSuabsakul GururatanaProblem statement: The power density of electronic devices has been increasing along with the rapid technology development. Cooling off electronic systems is essential in controlling the component temperature and avoiding any hot spot. The micro-devices are now extensively used in electronic application especially for cooling the computer chip. Approach: Micro-channel heat sinks are adopted in electronics cooling together with different … …American Journal of Applied Sciences, Vol. 9, Issue 3 · 28 Jan 2012 · 7,649 accessesView PDF Cite