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3 articles for “3D Stacked-die”
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Research ArticleOpen accessEvery word in the titleEffect of Manufacturing Stresses to Die Attach Film Performance In Quad Flatpack No-Lead Stacked Die PackagesM. F. Rosle, I. Abdullah, S. Abdullah et al.Problem statement: Repeated heat cure during assembly processes affected the Die Attach Film (DAF) material properties and the effectiveness touched area that leads to weak die bonding and delamination. Suitable die attached condition and DAF material selection had been evaluated to achieve required reliability performance in the manufacturing of the 3D Quad Flat No-Lead (QFN) stacked die package. Approach: During … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 8,048 accessesView PDFCite
Research ArticleOpen accessIn the keywordsHigh Gain Multiband Stacked DRA for WiMax and WLAN ApplicationsSugadev Mani, Logashanmugam EdeswaranDielectric resonator antennas find widespread applications in high speed wireless systems because of low loss, compact size and light weight. In this study, performance of a multiband Dielectric Resonator Antenna (DRA) with higher gain and improved radiation efficiency for 3.8 GHz band Wi-Max, fixed point satellite links and 4.8GHz band 5G services and 5GHz wireless networks is presented. The proposed … …American Journal of Applied Sciences, Vol. 14, Issue 8 · 3 Aug 2017 · 7,664 accessesView PDFCite
Research ArticleOpen accessIn the keywordsThermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow ProcessS. Abdullah, M. F. Abdullah, A. K. Ariffin, A. JalarThe copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability … …American Journal of Applied Sciences, Vol. 6, Issue 4 · 30 Apr 2009 · 7,715 accessesView PDFCite