14 articles for “bond strength”

Research ArticleOpen accessIn the abstractEffect of Manufacturing Stresses to Die Attach Film Performance In Quad Flatpack No-Lead Stacked Die PackagesM. F. Rosle, I. Abdullah, S. Abdullah et al.Problem statement: Repeated heat cure during assembly processes affected the Die Attach Film (DAF) material properties and the effectiveness touched area that leads to weak die bonding and delamination. Suitable die attached condition and DAF material selection had been evaluated to achieve required reliability performance in the manufacturing of the 3D Quad Flat No-Lead (QFN) stacked die package. Approach: During … …American Journal of Engineering and Applied Sciences, Vol. 2, Issue 1 · 31 Mar 2009 · 8,048 accessesView PDF Cite

Research ArticleOpen accessIn the abstractHydrophobic, Polar and Hydrogen Bonding Based Drug-Receptor Interaction of TetrahydroimidazobenzodiazepinonesV.K. Sahu, A.K.R. Khan, R.K. Singh, P.P. SinghAnti-HIV drug discovery has been increasingly focusing on HIV-1-RT (reverse transcriptase) as a potential therapeutic target. Tetrahydroimidazobenzodiazepinone (TIBO) belongs to non-nucleoside group of reverse transcriptase inhibitors (NNRTIs). A computational chemistry study has been performed on a series of tetrahydroimidazo-benzodiazepinones as HIV-1-NNRT inhibitors. Problem statement: In order to search out new drug of desired activity from the lead compounds, there was … …American Journal of Immunology, Vol. 4, Issue 3 · 30 Sep 2008 · 8,837 accessesView PDF Cite

Research ArticleOpen accessIn the abstractThe Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) DepositionM.K. Md Arshad, A. Jalar, I. Ahmad, G. OmarThis study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment to achieve successful nickel deposition and provide reliable interconnection of under bump metallurgy in advanced packaging. During this treatment process, the aluminum pad was cleaned, activated and … …American Journal of Applied Sciences, Vol. 4, Issue 3 · 31 Mar 2007 · 7,722 accessesView PDF Cite

Research ArticleOpen accessAll words, across the recordStochastic Model for Pricing Normal Bonds when Maturity Periods Cross Over to Pandemic PeriodSulaiman Sani, Siphelele LushabaIn this study, Ito form for normal bonds trading where maturity periods cross over to COVID-19 pandemic period is presented. It is shown that normal bonds in this period experience path reversals respective to their canonical paths. The criterion used in arriving at this striking result is also presented. As a key recommendation, it is necessary that bondholders enact flexible … …Journal of Mathematics and Statistics, Vol. 19, Issue 1 · 6 May 2023 · 6,094 accessesView PDF Cite