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American Journal of Engineering and Applied Sciences

ISSN 1941-7020 (print)eISSN 1941-7039 (online) Open access
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Research Article · Open access · Published 31 March 2010

Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

Z. Kornain, A. Jalar, N. Amin et al.
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Citing articles (5)

Read from Crossref’s cited-by service every week, newest first.

  1. doi:10.1007/s11664-026-13224-yFound 3 October 2026
  2. doi:10.1108/ssmt-03-2014-0008Found 12 June 2020
  3. doi:10.1109/epeps.2012.6457848Found 12 June 2020
  4. doi:10.1007/s11664-018-6162-4Found 12 June 2020
  5. doi:10.1007/s11664-018-6829-xFound 12 June 2020