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Research Article · Open access · Published 31 December 2009

A Novel Approach for Cooling Electronics Using a Combined Heat Pipe and Thermoelectric Module

Banjerd Saengchandr, Nitin V. Afzulpurkar
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Citing articles (10)

Read from Crossref’s cited-by service every week, newest first.

  1. doi:10.1063/5.0116986Found 24 May 2023
  2. doi:10.1016/j.csite.2021.101686Found 9 December 2021
  3. doi:10.3390/sym13081362Found 29 July 2021
  4. doi:10.1016/j.rser.2017.04.112Found 12 June 2020
  5. doi:10.1109/icaet.2014.7105296Found 12 June 2020
  6. doi:10.1016/j.enconman.2011.03.001Found 12 June 2020
  7. doi:10.1111/j.1747-1567.2011.00757.xFound 12 June 2020
  8. doi:10.1016/j.proeng.2011.03.028Found 12 June 2020
  9. doi:10.1016/j.matpr.2015.05.102Found 12 June 2020
  10. doi:10.1016/j.enconman.2012.03.020Found 12 June 2020