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American Journal of Applied Sciences

ISSN 1546-9239 (print)eISSN 1554-3641 (online) Open access
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Research Article · Open access · Published 31 July 2010

Lead Free Solder Joint Thermal Condition in Semiconductor Packaging

M. Najib Harif, Allina Nadzri, Kamaruzaman Jusoff
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Citing articles (1)

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  1. doi:10.1016/j.microrel.2012.07.032Found 12 June 2020