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American Journal of Applied Sciences

ISSN 1546-9239 (print)eISSN 1554-3641 (online) Open access
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Research Article · Open access · Published 30 April 2009

Thermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow Process

S. Abdullah, M. F. Abdullah, A. K. Ariffin, A. Jalar
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Citing articles (6)

Read from Crossref’s cited-by service every week, newest first.

  1. doi:10.1109/icept63120.2024.10668667Found 26 September 2024
  2. doi:10.1109/eptc59621.2023.10457647Found 28 March 2024
  3. doi:10.1109/eptc56328.2022.10013296Found 24 January 2023
  4. doi:10.1088/1742-6596/2131/4/042087Found 31 December 2021
  5. doi:10.3844/ajeassp.2010.740.748Found 12 June 2020
  6. doi:10.1109/iemt.2012.6521832Found 12 June 2020