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4 articles for “strength circuit”

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Research ArticleOpen accessIn the keywordsOptimization of Rowing Specific Training by Studying the Stages EvaluationSanda T Urichianu, Potop VladimirProblem statement: We intended to analyze and systematize the most valuable ways through which is achieved the optimization in rowing training by the evaluation of control norms, trials and tests during some stages of the training plan. We consider that the sports performances can become better and better thanks to a continuous improvement of the working methodology during the main … …Journal of Social Sciences, Vol. 7, Issue 3 · 18 Jul 2011 · 7,896 accessesView PDFCite
Research ArticleOpen accessIn the abstractIndividualization Training of Players on Positions at the Level of Handball Junior TeamsPitigoi GabrielProblem statement: Starting from the observation that for the handball players, who finished the junior state in hard to integrate in senior teams due to a low level of preparation. I hypothesized that at this level we can use all organizational forms of individual training (frontal relation, group level, individual).Using individual records, performance behavior characteristics of the players to positions, … …Journal of Social Sciences, Vol. 7, Issue 3 · 16 Jul 2011 · 7,238 accessesView PDFCite
Research ArticleOpen accessIn the abstractPerformance of Difference Electrode Materials in Electrical Discharge Machining of Tungsten CarbideP. Janmanee, A. MuttamaraProblem statement: Electrical Discharge Machining (EDM) is now a well-established machining option in many industries. Tungsten carbide (WC-Co) is an important tool and die material mainly because of its high hardness, strength, wear resistance and high melting point. Normally, EDM is capable of machining geometrically complex or hard material component, that are precise and difficult to machine. The objective of … …Energy Research Journal, Vol. 1, Issue 2 · 31 Oct 2010 · 8,874 accessesView PDFCite
Research ArticleOpen accessIn the abstractLead Free Solder Joint Thermal Condition in Semiconductor PackagingM. Najib Harif, Allina Nadzri, Kamaruzaman JusoffProblem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique … …American Journal of Applied Sciences, Vol. 7, Issue 7 · 31 Jul 2010 · 7,165 accessesView PDFCite