Research ArticleOpen accessIn the abstractAcoustic Properties of Innovative Material from Date Palm FibreLamyaa Abd AL-Rahman, Raja Ishak Raja, Roslan Abdul Rahman, Zawawi IbrahimAmerican Journal of Applied Sciences, Vol. 9, Issue 9 · 17 Jul 2012 · 8,094 accessesView PDFCite
190 articles for “data material”
Set a search alertResearch ArticleOpen accessIn the abstractThe Living Values-Based Contextual Learning to Develop the Students' CharacterKokom KomalasariJournal of Social Sciences, Vol. 8, Issue 2 · 6 Mar 2012 · 9,294 accessesView PDFCite
Research ArticleOpen accessIn the abstractStudy on Optical Constants and Refractive Index Dispersion of Neutral red Doped Polymer FilmHussain A. BadranAmerican Journal of Applied Sciences, Vol. 9, Issue 2 · 26 Dec 2011 · 8,919 accessesView PDFCite
Research ArticleOpen accessIn the abstractEthics Camp: The Appropriate Management Model for Northeastern Region Youth, Ecclesiastical Region 9Wongsathit Wisupee, Sastra Laoakka, Kosit PaengsoiJournal of Social Sciences, Vol. 7, Issue 2 · 4 Feb 2011 · 7,656 accessesView PDFCite
Research ArticleOpen accessIn the abstractMechanical Strength and Durability Properties of High Performance Mortar Containing Densified Silica FumeCheah Chee Ban, Mahyuddin RamliAmerican Journal of Applied Sciences, Vol. 8, Issue 1 · 31 Jan 2011 · 7,956 accessesView PDFCite
Research ArticleOpen accessIn the abstractOptimization of Mix Proportion of High Performance Mortar for Structural ApplicationsCheah Chee Ban, Mahyuddin RamliAmerican Journal of Engineering and Applied Sciences, Vol. 3, Issue 4 · 5 Nov 2010 · 8,810 accessesView PDFCite
Research ArticleOpen accessIn the abstractWork-Related Musculoskeletal Disorders among Workers' Performing Manual Material Handling Work in an Automotive Manufacturing CompanyBaba Md. Deros, Dian Darina Indah Daruis, Ahmad Rasdan Ismail et al.American Journal of Applied Sciences, Vol. 7, Issue 8 · 31 Aug 2010 · 9,404 accessesView PDFCite
Research ArticleOpen accessIn the abstractIndoor Positioning System Using Artificial Neural NetworkHamid Mehmood, Nitin K. Tripathi, Taravudh TipdechoJournal of Computer Science, Vol. 6, Issue 10 · 30 Aug 2010 · 8,838 accessesView PDFCite
Research ArticleOpen accessIn the abstractLead Free Solder Joint Thermal Condition in Semiconductor PackagingM. Najib Harif, Allina Nadzri, Kamaruzaman JusoffAmerican Journal of Applied Sciences, Vol. 7, Issue 7 · 31 Jul 2010 · 7,160 accessesView PDFCite
Research ArticleOpen accessIn the abstractSessile Drop Evaporation and Leidenfrost PhenomenonA. K. Mozumder, M. R. Ullah, A. Hossain, M. A. IslamAmerican Journal of Applied Sciences, Vol. 7, Issue 6 · 30 Jun 2010 · 7,948 accessesView PDFCite