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Research ArticleOpen accessIn the abstractLead Free Solder Joint Thermal Condition in Semiconductor PackagingM. Najib Harif, Allina Nadzri, Kamaruzaman JusoffProblem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique … …American Journal of Applied Sciences, Vol. 7, Issue 7 · 31 Jul 2010 · 7,165 accessesView PDF Cite

31 articles for “DAG”