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2 results for “Hong Lei”
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Research ArticleOpen accessIn the author namesPreparation and Polishing Properties of Spherical Porous Silica AbrasiveHong Lei, Hu Li, Ping Liu, Ruling ChenProblem statement: Abrasive is one of key influencing factors on the polished surface quality in Chemical Mechanical Polishing (CMP). Solid abrasives in CMP slurries are easy to cause polishing scratches. It is well known that reducing the hardness of abrasives would improve the polished surface quality. Therefore, the change in structure or shape of the abrasives means a change in … …Current Research in Nanotechnology, Vol. 1, Issue 1 · 15 Jun 2011 · 9,285 accessesView PDFCite