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Research Article · Open access · Published 19 January 2022

AI Based Mobile Bill Payment System using Biometric Fingerprint

Ayyaswamy Kathirvel1, D. Sudha2, S. Naveneethan3, M. Subramaniam4, Debashreet Das1 & Stewart Kirubakaran1

American Journal of Engineering and Applied Sciences, Volume 15, Issue 1, pp. 23–31 · doi.org/10.3844/ajeassp.2022.23.31

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Abstract

Billions of payment transactions occur in our day-to-day life, but every payment method depends on a material to carry. It is common for users to possess various materials like cash, credit cards and even mobiles to make payment. Meanwhile, it is easy for these materials to be robbed or lost. These instances result in a terrible trauma for the people. This study gives a detailed portrayal of a biometric payment application developed to introduce a concept of material-less payment. It enables the user to make a payment at any location by enrolling their fingertip without possessing any material. It involves a one-time registration of the User details upon all further transactions are validated and processed based on the user's fingerprint where the App takes care of the whole process. This implementation results in a novel payment method and avoids the risk of carrying valuable materials outdoors. This App creates an efficient and safe payment for society.

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Open access. This article is licensed under a Creative Commons Attribution 4.0 International Licence (CC BY 4.0), as printed on the article, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original authors and the source. No permission is needed.

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Kathirvel, A., Sudha, D., Naveneethan, S., Subramaniam, M., Das, D. & Kirubakaran, S. (2022). AI Based Mobile Bill Payment System using Biometric Fingerprint. American Journal of Engineering and Applied Sciences, 15(1), 23–31. https://doi.org/10.3844/ajeassp.2022.23.31

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Volume 15, Issue 1
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AI Based Mobile Bill Payment System using Biometric FingerprintAmerican Journal of Engineering and Applied Sciences · Volume 15, Issue 1 · pp. 23–31 · CC BY 4.0Download