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Research Article · Open access · Published 14 October 2022

Study of Mutual Coupling of Typical Commercial UHF RFID Tags in a High-Density Environment

Gbamélé Konan Fernand1, Akpata Edouard1, Assamoi Claude Daniel1, Gnamele N’tcho Assoukpou Jean1, Youan Bi Tra Jean Claude1, Ouattara Yelakan Berenger1 & Konan Kouassi Fransisco2

American Journal of Engineering and Applied Sciences, Volume 15, Issue 3, pp. 209–219 · doi.org/10.3844/ajeassp.2022.209.219

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Abstract

In the context of high-density passive UHF (Ultra High Frequency) RFID (Radio Frequency Identification) tag technology, the problem of mutual coupling has to be taken into account as one of the performance criteria of UHF RFID systems. In practical applications, mutual coupling changes the intrinsic parameters of the antennas attached to these tags, i.e., the impedance matching of the antenna and the chip and the radiation pattern. The objective of this study is to study the performance of some commercial tag prototypes by their level of sensitivity to mutual coupling. The 3D initialization model of the Printed Dipole, Printed T-Match, and Printed Meander tags were used to directly extract the mutual impedance values in various scenarios by the ANSYS HFSS software and compare them with the MATLAB software. The simulated results show the effectiveness of this study in obtaining a clear understanding of the performance of the tags. These results open new perspectives on the study of mutual tag-to-tag coupling for research and will help users to make better decisions in the choice of UHF RFID tags for the radio frequency identification of products.

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Fernand, G. K., Edouard, A., Daniel, A. C., Jean, G. N. A., Claude, Y. B. T. J., Berenger, O. Y. & Fransisco, K. K. (2022). Study of Mutual Coupling of Typical Commercial UHF RFID Tags in a High-Density Environment. American Journal of Engineering and Applied Sciences, 15(3), 209–219. https://doi.org/10.3844/ajeassp.2022.209.219

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Study of Mutual Coupling of Typical Commercial UHF RFID Tags in a High-Density EnvironmentAmerican Journal of Engineering and Applied Sciences · Volume 15, Issue 3 · pp. 209–219 · CC BY 4.0Download