Highly-Efficient Advanced Thermoelectric Devices from Different Multilayer Thin Films
Satilmis Budak1, Zhigang Xiao1, Barry Johnson1, Jordan Cole1, Mebougna Drabo1, Ashley Tramble2 & Chauncy Casselberry3 Show affiliations
- Alabama A&M University, United States
- Honeywell FM&T at the National Security Campus in Kansas City, United States
- Robins AFB, United States
American Journal of Engineering and Applied Sciences, Volume 9, Issue 2, pp. 356–363 · doi.org/10.3844/ajeassp.2016.356.363
Abstract
The efficiency of the thermoelectric materials and devices is shown by the dimensionless Figure of merit, ZT. ZT is calculated by multiplying the Seebeck coefficient with square of the electrical conductivity and absolute temperature and dividing it all by the thermal conductivity. Thermoelectric devices were prepared using different multilayered thin film structures in the order of SiO2/SiO2 + Ge/Ge/Sb + Ge/Si/Si + Ge/Ge/Ge + Si by DC/RF Magnetron Sputtering. The prepared thermoelectric devices have been tailored with 5 MeV Si ions bombardment at the different fluences (doses) to form quantum structures in the multilayer thin films to improve the efficiency of the thermoelectric devices. Seebeck coefficients, van der Pauw-four probe resistivity, Hall Effect coefficient, density and mobility have been measured. After the samples were prepared, SEM/EDS data were collected. FIB/SEM images were provided to figure out the cross-section of the fabricated devices. Seebeck coefficients and electrical resistivity results were affected positively if the appropriate ion beam dose was selected.
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Budak, S., Xiao, Z., Johnson, B., Cole, J., Drabo, M., Tramble, A. & Casselberry, C. (2016). Highly-Efficient Advanced Thermoelectric Devices from Different Multilayer Thin Films. American Journal of Engineering and Applied Sciences, 9(2), 356–363. https://doi.org/10.3844/ajeassp.2016.356.363
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