Low-doping Effects of Nanostructure ZnO: Sn tin films annealed at different temperature in Nitrogen ambient to be applied as an Anti-reflecting coating (ARC)
H. Abdullah1, M.N. Norazia1, S. Shaari1, M. Z. Nuawi1 & N. S. Mohamed Dan2 Show affiliations
- University Kebangsaan Malaysia, Malaysia
- University Putra Malaysia, Malaysia
American Journal of Engineering and Applied Sciences, Volume 3, Issue 1, pp. 171–179 · doi.org/10.3844/ajeassp.2010.171.179
Abstract
Problem statement: The focus of this research is to discover the significant influences of substituting low concentration Sn at Zn-site as an Anti-Reflecting Coating (ARC) for Zn1-xSnxO compound. The effects of tin dopants on the structural and morphology properties of ZnO thin films prepared using the sol-gel method were investigated. Approach: The effects of annealing temperature on the deposited films were also investigated at three different temperatures of 400, 500 and 600°C. The composition of the Zn1-xSnxO sample are x = 0.00, 0.05, 0.10 and 0.15. As a starting material, zinc acetate dehydrate was used; 2-methoxyethanol and mono ethanolamine were used as solvent and stabilizer, respectively. The dopant source was tin chloride. Results: Microstructural and surface morphology of samples were characterized by using Scanning Electron Microscopy (SEM). The crystallinity and defects are studied using X-Ray Diffraction (XRD). Molecular bonding is carried out using Raman spectroscopy and optical study of band gap is investigated using UV-VIS measurement. Conclusion: The value of band gap obtained increased slightly as the concentration of Sn increased. The increment of the band gap is acceptable as a requirement for good anti-reflecting coating element. Therefore these films can be applied on silicon solar cell.
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Abdullah, H., Norazia, M., Shaari, S., Nuawi, M. Z. & Mohamed Dan, N. S. (2010). Low-doping Effects of Nanostructure ZnO: Sn tin films annealed at different temperature in Nitrogen ambient to be applied as an Anti-reflecting coating (ARC). American Journal of Engineering and Applied Sciences, 3(1), 171–179. https://doi.org/10.3844/ajeassp.2010.171.179
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