Volume 1, Issue 1 (2010) | Current Research in Nanotechnology

Modeling of Piezoelectric Actuators Based on Bayesian Regularization Back Propagation Neural Network

Wen Wang — 2011-06-15

Current Research in Nanotechnology, Published online: 15 June 2011; doi:10.3844/ajnsp.2010.1.6

Problem statement: Piezoelectric actuator is a kind of key driving components for micropositioning stages, micropumps, micro valves, micro gripper and so on in the fields of micro/nano technology such...

Effects of Complexing Agent on Electrochemical Micro Machining of Stainless Steel

Chen Hui — 2011-06-15

Current Research in Nanotechnology, Published online: 15 June 2011; doi:10.3844/ajnsp.2010.7.12

Problem statement: Electrochemical Machining (ECM) is a prospective technique in micro machining. The productions of work piece in ECM are precipitation of hydroxide, which will block the machining ga...

Natural Sensitizer for Dye-Sensitized Solar Cells Using Three Layers of Photoelectrode Thin Films with a Schottky Barrier

Ho Chang — 2011-06-15

Current Research in Nanotechnology, Published online: 15 June 2011; doi:10.3844/ajnsp.2010.13.22

Problem statement: This study combines Au nanoparticles with TiO2 nanoparticles to form a Schottky barrier and applies it to the photoelectrode thin film of Dye-Sensitized Solar cells (DSSCs). Approac...

Research in the Improvement of Wettability of Micro-Structure in Patterned Electrodeposition

Li Guangyang — 2011-06-15

Current Research in Nanotechnology, Published online: 15 June 2011; doi:10.3844/ajnsp.2010.23.31

Problem statement: The high aspect-ratio electrodeposition was widely used in the manufacture of non-silicon MEMS devices. The wetting of high aspect-ratio micro-structure in electrolyte was importa...

Preparation and Polishing Properties of Spherical Porous Silica Abrasive

Hong Lei — 2011-06-15

Current Research in Nanotechnology, Published online: 15 June 2011; doi:10.3844/ajnsp.2010.32.39

Problem statement: Abrasive is one of key influencing factors on the polished surface quality in Chemical Mechanical Polishing (CMP). Solid abrasives in CMP slurries are easy to cause polishing scratc...